Advanced Technical Information
Dual CoolMOS ? 1) Power MOSFET
Common Source Topology
DCB isoated package
LKK 47-06C5
V DSS = 600 V
I D25 = 47 A
R DS(on) max = 45 m Ω / MOSFET
4
D1
2
T1
MOSFET T1/T2
G1
3
S
1
G2
5
D2
T2
1
2
3
4
5
Features
? fast CoolMOS ? 1) power MOSFET
Symbol
Conditions
Maximum Ratings
4 th generation
- High blocking capability
V DSS
V D1D2
V GS
I D25
I D90
T VJ = 25°C
T VJ = 25°C
T C = 25°C
T C = 90°C
600
±600
±20
47
32
V
V
V
A
A
- Lowest resistance
- Avalanche rated for unclamped
inductive switching (UIS)
- Low thermal resistance
due to reduced chip thickness
? Enhanced total power density
E AS
E AR
single pulse
repetitive
I D = 11 A; T C = 25°C
1950
3
mJ
mJ
Applications
? AC Switch
- power regulation of AC heating
- light dimming
? Power factor correction (PFC)
Symbol
Conditions
Characteristic Values
(T VJ = 25 ° C, unless otherwise specified)
interleaved operation mode
? Push pull converter
min.
typ.
max.
1)
CoolMOS ? is a trademark of
R DSon
R DSon
V GS = 10 V; I D = 44 A
total between D1 and D2
40
80
45 m Ω
m Ω
Infineon Technologies AG.
V G1S = V G2S = 10 V; I D = 44 A
V GSth
I DSS
V DS = V GS ; I D = 3 mA
V DS = V DSS ; V GS = 0 V; T VJ = 25°C
2.5
3
3.5
10
V
μA
T VJ = 125°C
50
μA
I GSS
C iss
C oss
V GS = ±20 V; V DS = 0 V
V GS = 0 V; V DS = 100 V
f = 1 MHz
6800
320
100
nA
pF
pF
Q g
Q gs
Q gd
t d(on)
t r
t d(off)
t f
V GS = 0 to10 V; V DS = 400 V; I D = 44 A
V GS = 10 V; V DS = 400 V;
I D = 44 A; R G = 3.3 Ω
150
35
50
30
20
100
10
190
nC
nC
nC
ns
ns
ns
ns
R thJC
0.45 K/W
R thCH
with heatsink compound
0.25
K/W
IXYS reserves the right to change limits, test conditions and dimensions.
? 2009 IXYS All rights reserved
20090209b
1-4
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